Bondexpo

Bondexpo Trade Fair

The Bondexpo is the international trade fair for adhesive and bonding technologies, targeting manufacturers, developers, engineers, and decision-makers in industry. It provides a platform to showcase innovative adhesive, sealing, and bonding solutions, machinery, tools, and materials for production.

The fair covers topics such as adhesive technology, joining processes, adhesives, surface preparation, testing technology, automation solutions, and industrial applications. Exhibitors present technologies and products that help companies optimize production processes, improve quality, and explore new applications.

In addition to the exhibition, Bondexpo offers a program of expert lectures, workshops, and demonstrations, providing insights into current trends, research results, and best practices.

Bondexpo serves as a central meeting point for engineers, production managers, research institutions, machine builders, and suppliers looking to expand their networks, find new partners, and stay informed about innovations in bonding technology.